Power chips are connected to external circuits with packaging, and their performance depends upon the assistance of the product packaging. In high-power scenarios, power chips are typically packaged as power components. Chip affiliation refers to the electric connection on the top surface of the chip, which is usually aluminum bonding cable in typical modules. ^
Typical power module plan cross-section
Presently, commercial silicon carbide power modules still mainly use the product packaging modern technology of this wire-bonded traditional silicon IGBT component. They deal with issues such as large high-frequency parasitic criteria, not enough heat dissipation capacity, low-temperature resistance, and inadequate insulation strength, which restrict using silicon carbide semiconductors. The display of exceptional performance. In order to solve these issues and fully exploit the substantial potential advantages of silicon carbide chips, several brand-new product packaging innovations and remedies for silicon carbide power components have emerged in the last few years.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have developed from gold cord bonding in 2001 to aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually developed from gold cords to copper cables, and the driving force is cost decrease; high-power devices have developed from light weight aluminum cables (strips) to Cu Clips, and the driving force is to boost item performance. The higher the power, the higher the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a strong copper bridge soldered to solder to link chips and pins. Compared to typical bonding product packaging methods, Cu Clip modern technology has the following benefits:
1. The link in between the chip and the pins is made from copper sheets, which, to a specific extent, changes the standard cord bonding technique between the chip and the pins. For that reason, a special plan resistance worth, higher present flow, and much better thermal conductivity can be acquired.
2. The lead pin welding area does not require to be silver-plated, which can completely conserve the cost of silver plating and inadequate silver plating.
3. The product appearance is completely constant with normal products and is mostly used in web servers, portable computers, batteries/drives, graphics cards, electric motors, power materials, and other fields.
Cu Clip has 2 bonding techniques.
All copper sheet bonding technique
Both eviction pad and the Resource pad are clip-based. This bonding technique is more expensive and intricate, however it can accomplish much better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus wire bonding method
The source pad utilizes a Clip method, and the Gate utilizes a Cable approach. This bonding approach is a little more affordable than the all-copper bonding method, saving wafer location (applicable to extremely tiny entrance locations). The procedure is easier than the all-copper bonding technique and can acquire better Rdson and better thermal result.
Distributor of Copper Strip
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